Fastest and method of soldering through-hole components post reflow
Pallets permit wave solder processing of through hole components while masking solder side SMT components and critical board features from molten solder
Provides strong, stable supports for PCB throughout wave solder process
Permit wave solder processing of through-hole components when masking solder side SMT components and critical board features from molten solder
Provides thermal protection for printed circuit board areas which are heat sensitive
Prevents topside component movement throughout wave solder
Align and position topside components throughout wave solder
Increases assembly production efficiently by eliminating hand gluing and masking operations
Repeatable process results in assembly lines
Abate bridging and skipping soldering defects
Provides safe, easy and ergonomic handling of PCB
Maximum possible knife edge beveling of fixture openings, provides best possible solder flow to component leads
Promotes better solder flow
Ergonomic PCB and component hold downs
Pallet design keeps bottom of circuit board coplanar with conveyor
ESD composite construction protects sensitive components by providing controlled static discharge
Free PCB pocket covers provided with multi-up fixtures
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Supplier and product information updated April 16, 2012.
Verified Business Registration Details
Registered Company:
深圳市依宁安博科技有限公司
Business Registration Number: 440306104085177
Company Registration Address: 深圳市龙华三联老河背工业区第一栋 * In some jurisdictions, company names and addresses are registered in Chinese only.
